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Flexible Electronics News

DuPont MCM Extends PE Research and Holst Centre Collaboration

Advancing OLED lighting, wearable electronics and smart packaging technologies

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

DuPont Microcircuit Materials (DuPont) and Holst Centre have extended their collaboration focused on advanced materials for the printed electronics industry. The collaboration is expected to advance technology specifically in the area of OLED lighting, wearable electronics, in-mold electronics, sensors and smart packaging.

“DuPont is pleased to continue its collaboration with Holst Centre to enhance the potential for significant new materials for printed electronics,” said Kerry Adams, European marketing manager, DuPont Microcircuit Materials. “Continued innovation will be key to unlocking new opportunities in this market as we have seen with our recent advances in nano-silver conductor inks for OLED lighting.”

DuPont will continue as a partner in Holst Centre’s research on printing technologies and will additionally contribute to the prototype development of wearable, formable and stretchable electronics in order to help accelerate the uptake of new materials in real applications. The work will concentrate on optimizing printed metallic structures on flexible substrates in terms of conductivity, fine line deposition and low energy sintering. A variety of roll-to roll compatible printing techniques will be studied including screen, flexography and ink jet. Alternative conductor metallurgies will be studied as well as reactive systems for depositing conductive traces.

“Holst Centre and DuPont have had a longstanding and successful collaboration,” said Pim Groen, program manager, Printed Structures on Flexible Substrates. “It is exciting to extend that into new areas of technology.”

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